Copper electroless deposition technology for ultra-large-scale-integration (ULSI) metallization

Microelectronic Engineering

Volumn 33, Issue 1-4, 1997, Pages 47-58

  Shacham Diamand, Yosi ^a,c   Dubin, Valery M ^b  

^a Cornell University   (United States)

^b ADVANCED MICRO DEVICES   (United States)

^c TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASPECT RATIO; COPPER; DISSOLUTION; ELECTROLESS PLATING; FLUORINE; IONS; METALLIC FILMS; METALLIZING; SOLUTIONS; SURFACE ROUGHNESS; ULSI CIRCUITS;

COPPER ELECTROLESS DEPOSITION TECHNIQUE;

MICROELECTRONIC PROCESSING;

EID: 0002001622     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0167-9317(96)00030-5     Document Type: Article

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