Copper on-chip interconnections: A breakthrough in electrodeposition to make better chips

Electrochemical Society Interface

Volumn 8, Issue 1, 1999, Pages 32-37

  Andricacos, Panos C ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPRESSIVE STRESS; COPPER PLATING; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC RESISTANCE; ELECTRON SCATTERING; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; STRESS RELAXATION; TENSILE STRESS;

DAMASCENE PLATING;

MICROPROCESSOR CHIPS;

EID: 0033097801     PISSN: 10648208     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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