Characteristics of Cu films prepared using a magnetron sputter type negative ion source (MSNIS)

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 229, Issue 3-4, 2005, Pages 436-442

  Paik, Namwoong ^a  

^a Plasmion Corporation   (United States)

Author keywords

Cu negative ion trench; Metallization

Indexed keywords

ASPECT RATIO; ATOMIC FORCE MICROSCOPY; COPPER; IMAGE PROCESSING; ION SOURCES; MAGNETRON SPUTTERING; METALLIZING; PERTURBATION TECHNIQUES; PROBABILITY; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE ROUGHNESS;

CU NEGATIVE ION TRENCH; ELECTRON AFFINITY; IONIZED PHYSICAL VAPOR DEPOSITION (I-PVD); MAGNETRON SPUTTER TYPE NEGATIVE ION SOURCES (MSNIS);

METALLIC FILMS;

EID: 14544292456     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nimb.2004.12.123     Document Type: Article

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