The effect of tungsten and boron on the Cu barrier and oxidation properties of thin electroless cobalt-tungsten-boron films

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 623-628

  Einati, Hila ^a   Bogush, Vadim ^b   Sverdlov, Yelena ^a   Rosenberg, Yuri ^a   Shacham Diamand, Yosi ^a,c  

^a TEL AVIV UNIVERSITY   (Israel)

^b BELARUSIAN STATE UNIVERSITY OF INFORMATICS AND RADIOELECTRONICS   (Belarus)

^c WASEDA UNIVERSITY   (Japan)

Author keywords

Barrier; CoWB; Electroless

Indexed keywords

BORON; COPPER; ELECTRIC RESISTANCE; ELECTROLESS PLATING; METALLIZING; MORPHOLOGY; OXIDATION; THIN FILMS;

BARRIER; COWB; ELECTROLESS;

TUNGSTEN;

EID: 28044451073     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.082     Document Type: Conference Paper

References (9)

1. The International Roadmap for Semiconductors (ITRS) 2002 Update, published by the Semiconductor Industry Association. Available from: < http://www.itrs.net >.
2. P.C. Andricacos, C. Uzoh, J.O. Dukovic, J. Horkans, and H. Deligianni IBM J. Res. Dev. 42 1998 567 574
3. A. Kohn, M. Eizenberg, and Y. Shacham-Diamand Appl. Surf. Sci. 212-213 2003 367 372
4. Y. Shacham-Diamand, A. Zylberman, N. Petrov, and Y. Sverdlov Microelectron. Eng. 64 2002 315 320
5. M.-A. Nicolet Thin Solid Films 52 1978 415
6. H. Ono, T. Nakano, and T. Ohta Appl. Phys. Lett. 64 12 1994 1511 1513
7. A. Datta, K.T. Nam, S.-H. Kim, and K.-B. Kima J. Appl. Phys. 92 2 2002 1099 1105
8. T. Osaka, N. Takano, T. Kurokawa, T. Kaneko, and K. Ueno Surf. Coat. Tech. 169-170 2003 124 127
9. Y. Sverdlov, V. Bogush, H. Einati, Y. Shacham-Diamand, in: The Abstracts of 55th Annual Meeting of International Society of Electrochemistry, 2004.