Critical concerns in soldering reactions arising from space confinement in 3-D IC packages

IEEE Transactions on Device and Materials Reliability

Volumn 12, Issue 2, 2012, Pages 233-240

  Chuang, H Y ^a   Yang, T L ^a   Kuo, M S ^a   Chen, Y J ^a   Yu, J J ^a   Li, C C ^a   Kao, C Robert ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compound (IMC); solder volume effect; soldering; space confinement; three dimensional integrated circuits (3 D ICs)

Indexed keywords

3-D ICS; ALLOY ELEMENT; CRITICAL ISSUES; EXPERIMENTAL EVIDENCE; IC PACKAGE; IMPURITIES IN; IMPURITY CONCENTRATION; MORPHOLOGY EVOLUTION; SOLDER JOINTS; SOLDER VOLUME; SOLDERING REACTIONS; SPACE CONFINEMENT; STRUCTURAL DEFECT; STRUCTURE DEFECTS; SURFACE FINISHES; THIN FILM LAYERS; UNDER-BUMP METALLURGIES; VOLUME RATIO; VOLUME SHRINKAGE;

FINISHING; GOLD; IMPURITIES; INTEGRATED CIRCUITS; INTERMETALLICS; SHRINKAGE; SOLDERING; SOLDERING ALLOYS; THREE DIMENSIONAL;

TIN;

EID: 84862026416     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2012.2185239     Document Type: Article

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