Solid state interfacial reactions in electrodeposited Ni/Sn couples

International Journal of Minerals, Metallurgy and Materials

Volumn 17, Issue 4, 2010, Pages 459-463

  Tang, Wen Ming ^a   He, An Qiang ^b   Liu, Qi ^b   Ivey, Douglas G ^b  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Diffusion; Electrodeposition; Kinetics; Microstructure; Solid state reaction

Indexed keywords

APPARENT ACTIVATION ENERGY; INTERFACIAL REACTIONS; INTERMEDIATE PHASIS; PARABOLIC GROWTH; ROOM TEMPERATURE; SI WAFER;

ACTIVATION ENERGY; ANNEALING; ELECTRODEPOSITION; GROWTH KINETICS; MICROSTRUCTURE; REACTION KINETICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TIN;

SOLID STATE REACTIONS;

EID: 77955599321     PISSN: 16744799     EISSN: 1869103X     Source Type: Journal    
DOI: 10.1007/s12613-010-0341-5     Document Type: Article

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