Reliable microjoints formed by solid-liquid interdiffusion (SLID) Bonding within a chip-stacking architecture

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 6, 2012, Pages 979-984

  Chang, Jing Yao ^a,b   Cheng, Ren Shin ^a   Kao, Kuo Shu ^a   Chang, Tao Chih ^a   Chuang, Tung Han ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Intermetallic; microbump; reliability; solid liquid interdiffusion

Indexed keywords

BONDING PROCESS; CU PILLAR; FAILURE MECHANISM; FLUX RESIDUES; LIFE SPAN; MICRO GAPS; MICRO-BUMPS; PEAK TEMPERATURES; PURE SN; RELIABILITY ASSESSMENTS; RELIABILITY PERFORMANCE; SOLID-LIQUID; TEMPERATURE CYCLING TESTS; TEST VEHICLE; UNDERFILLS; VOLUME CONTRACTION;

BONDING; FRACTURE; INTERMETALLICS; RELIABILITY; RELIABILITY ANALYSIS; SILICON; SILICON WAFERS; TIN;

WAFER BONDING;

EID: 84861937215     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2190290     Document Type: Article

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