Investigation of intermetallic compound growth enhanced by electromigration in Pb-free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1442-1449

  Chae, Seung Hyun ^a   Chao, Brook ^a   Zhang, Xuefeng ^a   Im, Jay ^a   Ho, Paul S ^a  

^a The University of Texas at Austin   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMIGRATION (EM) PARAMETERS; INTERMETALLIC COMPOUND GROWTH; SOLDER BUMPS; UNDERBUMP-METALLURGY (UBM);

ELECTROMIGRATION; INTERMETALLICS; PARAMETER ESTIMATION; STRAIN RATE; STRESS ANALYSIS; SURFACE DIFFUSION;

SOLDERED JOINTS;

EID: 35348852530     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373985     Document Type: Conference Paper

References (45)

1. Miller, L. F., "Controlled Collapse Reflow Chip Joining," IBM J. Res. Develop., Vol. 13 (1969), p. 239.
2. Tonnies, D., "Overview and Trends in Flip Chip Technology," The SUSS Report, 3rd Quarter 2004, p. 22.
3. Tu, K. N. and Zeng, K., "Tin-Lead (SnPb) Solder Reaction in Flip Chip Technology," Mater. Sei. Eng. R, Vol. 34, No. 1 (2001), pp. 1-58.
4. Tu, K. N., Gusak, A. M. and Li, M., "Physics and Materials Challenges for Lead-Free Solders," J. Appl. Phys., Vol. 93 (2003), pp. 1335-1353.
5. Chen, S. and Chen, C., "Electromigration Effects upon Interfacial Reactions," JOM (2003), pp. 62-67.
6. Gan, H. and Tu, K. N., "Polarity Effect of Electromigration on Kinetics of Intermetallic Compound Formation in Pb-Free Solder V-Groove Samples," J. Appl. Phys., Vol. 97 (2005), p. 063514.
7. Chae, S.-H. et al., "Electromigration Statistics and Damage Evolution for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages," J. Mater. Sci.: Mater. Electron., Vol. 18, No. 1-3 (2007), pp. 247-258.
8. Ding, M et al., "Effect of Contact Metallization on Electromigration Reliability of Pb-Free Solder Joints," J. Appl. Phys., Vol. 99 (2006), p. 094906.
9. Shao, T. L., Liang, S. W., Lin, T. C. and Chen, C., "Three- Dimensional Simulation on Current-Density Distribution in Flip-Chip Solder Joints under Electric Current Stressing," J. Appl. Phys., Vol. 98 (2005), p. 044509.
10. Fan, L., Tison, C. K. and Wong, C. P., "Study on Underfill/Solder Adhesion in Flip-Chip Encapsulation," IEEE Trans. Adv. Packag., Vol. 25, No. 4 (2002), pp. 473-480.
11. Zhang, L. et al., "Effect of Current Crowding on Void Propagation at the Interface between Intermetallic Compound and Solder in Flip Chip Solder Joints," Appl. Phys. Lett., Vol. 88 (2006), p. 012106.
12. 0.5 Microbumps," Appl. Phys. Lett., Vol. 88 (2006), p. 072102.
13. Chao, B. et al., "Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solder Joints," J. Appl. Phys., Vol. 100 (2006), p. 084909.
14. Kirkpatrick, S, Gelatt, C. D. and Vecchi, M. P., "Optimization by Simulated Annealing," Science, Vol. 220, No. 4598 (1983), pp. 671-680.
15. Metropolis, N. et al., "Equation of State Calculations by Fast Computing Machines," J. Chem. Phys., Vol. 21, No. 6 (1953), pp. 1087-1092.
16. Seith, W. and Heumann, T., Diffusion of Metals: Exchange Reactions, United States Atomic Energy Commission, translated from a publication of Springer Press (Berlin, 1962), pp. 65-68.
17. Davis, J. R. (editor), ASM Specialty Handbook: Copper and Copper Alloys, ASM International (2001), p. 235.
18. Seitz, F., Turnbull, D. and Ehrenreich, H. (editors), Solid State Physics: Advances in Research Applications, Vol. 22, Academic Press (New York, 1968).
19. Dyson, B. F. Anthony, T. R. and Turnbull, D., "Interstitial Diffusion of Copper in Tin," J. Appl. Phys., Vol. 38, No. 8 (1967), p. 3408.
20. Hoshino, K, Iijima, Y. and Hirano, K. I., Trans. Japan Ins. Metals., Vol. 21 (1980), p. 674.
21. Onishi, M. and Fujibuchi, H., Trans. Japan Ins. Metals, Vol. 16, No. 9(1975), p. 539.
22. Mei, Z., Sunwoo, A. J. and Morris Jr., J. W., Metall. Trans. A, Vol. 23A (1992), p. 857.
23. 5 Thin-Film Diffusion Couples," Appl. Phys. Lett., Vol. 67, No. 19 (1995), p. 2795-2797.
24. Bader, S., Gust, W. and Hieber, H., "Rapid Formation of Intermetallic Compounds by Interdiffusion in the Cu-Sn and Ni-Sn Systems," Acta Metall. Mater., Vol. 43, No. 1 (1995), pp. 329-337.
25. Elcock, E. W. andMcCombie, C. W., "Vacancy Diffusion in Binary Ordered Alloys," Phys. Rev., Vol. 109 (1958), p. 605.
26. Huntington, H. B., Miller, N. C. and Nerses, V., "Self-diffusion in 50-50 Gold-Cadmium," Acta Metall., Vol. 9, No. 8 (1961), pp. 749-754.
27. Bakker, H., Philos. Mag. A, Vol. 40, No. 4 (1979), p. 525.
28. Grone, A. R., "Current-Induced Marker Motion in Copper," J. Phys. Chem. Solids, Vol. 20, No. 1-2 (1961), pp. 88-93.
29. Sullivan, G. A., "Search for Reversal in Copper Electromigration, " J. Phys. Chem. Solids, Vol. 28, No. 2 (1967), pp. 347-350.
30. Grimme, D., Atomic Transport in solids and Liquids (1971).
31. Liu, C. Y., Chen, C and Tu, K. N., "Electromigration in Sn-Pb Solder Strips as a Function of Alloy Composition," J. Appl. Phys., Vol. 88, No. 10 (2000), pp. 5703-5709.
32. Khosla, A. Huntington, H. B., "Electromigration in Tin Single Crystals," J. Phys. Chem. Solids, Vol. 36, No. 5 (1975), pp. 395-399.
33. Hsieh, M. Y. and Huntington, H. B., "Electromigration of Copper in Lead," J. Phys. Chem. Solids, Vol. 39, No. 8 (1978), pp. 867-871.
34. Siewert, T. A., Madeni, J. C. and Liu, S., Proc. APEX Conf. on Electronics Manufacturing, 2003.
35. Cheng, Y.-W. and Siewert, T. A., "Predicting Tensile Properties of the Bulk 96.5Sn-3.5Ag Lead-Free Solder," J. Electron. Mater., Vol. 32, No. 6 (2003), pp. 535-540.
36. Merchant, H. D., Khatibi, G. and Weiss, B., "Elastic and Elastoplastic Response of Thin Copper Foil," J. Mater. Sci., Vol. 39 (2004), pp. 4157-4170.
37. Cho, H. S. et al., "Tensile, Creep and Fatigue Properties of LIGA Nickel Structures," Proc. 15th IEEE International Conf. on Micro Electro Mechanical Systems, Jan. 2002, pp. 439-442.
38. Chromik, R. R. et al., "Nanoindentation Measurements on Cu-Sn and Ag-Sn Intermetallics Formed in Pb-Free Solder Joints," J. Mater. Res., Vol. 18, No. 9 (2003), pp. 2251-2261.
39. Siewert, T. et al., Database for Solder Properties with Emphasis on New Lead-Free Solders, NIST (2002).
40. 4 Intermetallic Compounds in the Solder Bump," J. Electon. Mater., Vol. 33, No. 10 (2004), pp. 1103-1110.
41. Mallory, G. O. and Hajdu, J. B., Electroless Plating Fundamentals and Applications (New York: Amer. Electroplaters & Surface Finishers Soc., 1990), Ch. 1 and 4.
42. Islam, M. S., Suhling, J. C. and Lall, P., "Measurement of the Temperature Dependent Constitutive Behavior of Underfill Encapsulants," IEEE Trans. Comp. Packag. TechnoL, Vol. 28, No. 3 (2005), pp. 467-476.
43. Moore, T and Jarvis, J., "Failure Analysis and Stress Simulation in Small Multichip BGAs," Proc. 38th International Reliability Physics Symposium, Apr. 2000, pp. 217-224.
44. Gleixner, R. J., Clemens, B. M. and Nix., W. D., "Void Nucleation in Passivated Interconnect Lines: Effects of Site Geometries, Interfaces, and Interface Flaws," J. Mater. Res., Vol. 12, No. 8 (1997), pp. 2081-2090.
45. Zhang, Z., Suo, Z. and He, J., "Saturated Voids in Interconnect Lines due to Thermal Strains and Electromigration," J. Appl. Phys., Vol. 98 (2005), p. 074501.