Secondary IMC formation Induced by Kirkendall voiding In Cu/Sn-3.5Ag solder joints

Journal of Materials Research

Volumn 25, Issue 9, 2010, Pages 1854-1858

  Kim, S H ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TREATMENT; ATOMIC RATIO; CROSS-SECTIONAL SCANNING ELECTRON MICROSCOPIES; CU UNDER BUMP METALLURGIES; INTERMETALLIC COMPOUNDS; KIRKENDALL; KIRKENDALL VOID; NET SECTION; SEM; SN-3.5AG SOLDERS; SOLDER JOINTS;

INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SCHEMATIC DIAGRAMS; SILVER; SODIUM; SOLDERING ALLOYS;

TIN;

EID: 77958045662     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.0232     Document Type: Article

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