Effects of reactive diffusion on stress evolution in Cu-Sn films

Scripta Materialia

Volumn 51, Issue 2, 2004, Pages 167-170

  Song, J Y ^a   Yu, Jin ^a   Lee, T Y ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hanbat National University   (South Korea)

Author keywords

Diffusion; Phase transformation; Stress

Indexed keywords

ANNEALING; COPPER ALLOYS; DIFFUSION; ELECTROPLATING; MICROELECTRONICS; PHASE TRANSITIONS; RELIABILITY; RESIDUAL STRESSES; SHRINKAGE; TENSILE STRESS; TRANSMISSION ELECTRON MICROSCOPY; VOLUME MEASUREMENT; X RAY DIFFRACTION;

INTERFACIAL REACTION; INTRINSIC STRESS; ISOTHERMAL AGING;

METALLIC FILMS;

EID: 2342612808     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2004.03.032     Document Type: Article

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