Early failure induced by phase transformation in microjoints for chip-level integration

Electrochemical and Solid-State Letters

Volumn 15, Issue 3, 2012, Pages

  Cheng, Ren Shin ^a   Chang, Hung Jen ^b   Chang, Tao Chih ^a   Chou, Jung Hua ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-LEVEL INTEGRATION; EARLY FAILURE; FATIGUE STRESS; MICRO-BUMPS; MICROPORES; PHASE TRANSFORMATION; REFLOW--SOLDERING; SEED LAYER THICKNESS; STAND OFF HEIGHT; TEMPERATURE CYCLING; THERMOCOMPRESSIVE BONDING;

FLIP CHIP DEVICES; NUMERICAL ANALYSIS; TIN;

SOLDERING;

EID: 84855955694     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/2.023203esl     Document Type: Article

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