Behavior of surface oxide and intermetallic compounds in interconnections of micro Sn-Ag solder bumps

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1141-1146

  Suga, Tadatomo ^a   Ozaki, Hiroshi ^b   Ozawa, Hayato ^b  

^a UNIVERSITY OF TOKYO   (Japan)

^b SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); INTERMETALLICS; OPTICAL INTERCONNECTS; RELIABILITY THEORY; SILVER; SOLDERING; TIN;

CHIP ON CHIP (COC); MICRO SOLDER BUMPS; SURFACE OXIDES; SYSTEM ON CHIP (SOC);

ELECTRONICS PACKAGING;

EID: 33845581269     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645797     Document Type: Conference Paper

References (4)

1. T. Ezaki et al.,"A 160-Gbps Interface Design Configuration for Multichip LSI" ISSCC 2004.
2. Y. C. Chan, P. L. Tu, C. W. Tang, K. C. Hung, and J. K. L. Lai, "Reliability Studies of μBGA Solder Joints-Effect of Ni-Sn Intermetallic Compound" IEEE Transactions on Advanced Packaging, vol. 24, no. 1, Feb. 2001.
3. 3P layer between Sn-3.5Ag solder and electroless Ni-P substrate" J. of All. and Comp. 376 (2004) 105-110.
4. H. Ozawa, M. Howladar, T. Suga, H. Ozaki, and M. Sato, "Surface oxidization action and bonding characteristics of lead-free solder bumps" MES2004, pp. 129-132.