An innovative passive cooling method for high performance light-emitting diodes

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2012, Pages 319-324

  Fan, Angie ^a   Bonner, Richard ^a   Sharratt, Stephen ^b   Ju, Y Sungtaek ^b  

^a Advanced Cooling Technologies Inc   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

boiling heat transfer enhancement; high power LEDs; low temperature sintering; PCB based dielectric planar themosyphon; Two phase passive cooling

Indexed keywords

BOILING HEAT TRANSFER ENHANCEMENT; HIGH POWER LED; LOW-TEMPERATURE SINTERING; PASSIVE COOLING; PCB-BASED;

CAPILLARY FLOW; COOLING; ELECTRONICS INDUSTRY; ELECTROPLATING; ENERGY UTILIZATION; HEAT PIPES; HEAT TRANSFER COEFFICIENTS; INTERFACES (MATERIALS); LIQUIDS; ORGANIC POLLUTANTS; PHASE TRANSITIONS; PRINTED CIRCUIT BOARDS; SIPHONS; TEMPERATURE; THERMAL VARIABLES MEASUREMENT; VAPORS; WASTE HEAT;

LIGHT EMITTING DIODES;

EID: 84861125944     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2012.6188867     Document Type: Conference Paper

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