Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 667-672

  Lu, Dong ^a   Liu, Chenmin ^a   Lang, Xianxin ^a   Wang, Bo ^a   Li, Zhiying ^a   Lee, W M Peter ^a   Lee, S W Ricky ^b  

^a Nano and Advanced Materials Institute Limited   (Hong Kong)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE ADHESIVE; DIE ATTACH ADHESIVE; FUNCTIONALIZATIONS; HIGH BRIGHTNESS; HIGH BRIGHTNESS LEDS; LARGE PARTICLES; LARGE SCALE SYNTHESIS; LOW COSTS; MULTI-CHANNEL; NANO-FILLERS; NANO-SIZED; NANOCHAINS; SILVER NANORODS; SILVER PARTICLES; THERMAL CONDUCTIVITY MEASUREMENTS;

ADHESIVES; ELECTRONICS PACKAGING; FILLERS; LIGHT EMITTING DIODES; LUMINANCE; NANORODS; NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; SILVER; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

THERMAL CONDUCTIVITY;

EID: 79960414062     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898585     Document Type: Conference Paper

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