Research progress on packaging thermal management techniques of high power LED

Advanced Materials Research

Volumn 347-353, Issue , 2012, Pages 3989-3994

  Zhang, Jianxin ^a,b   Niu, Pingjuan ^a,b   Gao, Dayong ^b   Sun, Liangen ^b  

^a TIANJIN POLYTECHNIC UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

Author keywords

Heat dissipation; High power LED; Junction temperature; Packaging thermal management; Thermal resistance

Indexed keywords

ELECTRICAL POWER; EMITTING WAVELENGTHS; HIGH HEAT FLUX; HIGH POWER LED; JUNCTION TEMPERATURES; LIFE-TIMES; LIGHT-OUTPUT EFFICIENCY; LIGHTING MARKET; RESEARCH PROGRESS; TECHNICAL RESEARCH; THERMAL DESIGNS; THERMAL PATHS; THERMAL POWER;

ELECTRIC LOSSES; HEAT FLUX; HEAT RESISTANCE; PACKAGING; RESEARCH; RESEARCH AND DEVELOPMENT MANAGEMENT; SUSTAINABLE DEVELOPMENT; TEMPERATURE CONTROL;

LIGHT EMITTING DIODES;

EID: 80155132505     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.347-353.3989     Document Type: Conference Paper

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