High brightness LED assembly using DPC substrate and superMCPCB

IMPACT Conference 2009 International 3D IC Conference - Proceedings

Volumn , Issue , 2009, Pages 199-202

  Wang, Nick ^a   Hsu, Allen ^a   Lim, Andy ^a   Tan, Jerry ^a   Lin, Charles ^a   Ru, Heinz ^b   Jiang, Thompson ^b   Liao, David ^b  

^a Bridge Semiconductor Corporation   (Taiwan)

^b Tong Hsing Electronic Industries Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALN; COMBINED STRUCTURE; COPPER METALLIZATION; DIRECT BOND; HEAT SPREADERS; HIGH BRIGHTNESS LEDS; INTEGRAL PART; LEAD FREE SOLDERS; LED DEVICE; METAL POSTS; SURFACE METALLIZATION; THERMAL CONTACT; THERMAL PATHS; THERMAL PERFORMANCE;

BONDING; COPPER; COPPER CORROSION; LEAD; METALLIZING; THREE DIMENSIONAL;

SUBSTRATES;

EID: 77950817608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2009.5382142     Document Type: Conference Paper

References (4)

1. DPC Patent No.: US 6,800,211 B2
2. http://metallized-ceramic.ready-online.com/company-story.html
3. V.Székely, V.B. Tran, Fine structure of heat flow path in semiconductor devices: a measurement and identification method, Solid-State Electron. 31 (1988) 1363-1368).