Low thermal resistance LED light source with vapor chamber coupled fin heat sink

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1347-1352

  Luo, Xiaobing ^a,b   Hu, Run ^a   Guo, Tinghui ^a   Zhu, Xiaolei ^a   Chen, Wen ^a   Mao, Zhangming ^a   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; BASE PLATES; BASIC PRINCIPLES; EXPERIMENTAL TEST; FIN HEAT SINKS; HEAT DISSIPATION; HEAT REMOVAL CAPACITY; HIGH POWER LED; LED LIGHT SOURCE; NUMERICAL SIMULATION; OVERALL THERMAL RESISTANCE; SIMULATED RESULTS; THERMAL RESISTANCE; VAPOR CHAMBER;

COMPUTER SIMULATION; FINS (HEAT EXCHANGE); LIGHT SOURCES; VAPORS;

HEAT RESISTANCE;

EID: 77955211805     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490645     Document Type: Conference Paper

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