A liquid metal cooling system for the thermal management of high power LEDs

International Communications in Heat and Mass Transfer

Volumn 37, Issue 7, 2010, Pages 788-791

  Deng, Yueguang ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

Heat dissipation; Light emitting diode (LED); Liquid metal cooling

Indexed keywords

ACTIVE COOLING; COOLING CAPABILITY; HEAT DISSIPATION; HIGH POWER LED; HIGH POWER LIGHT EMITTING DIODES; LIQUID METAL COOLING; OPERATION CONDITIONS; THERMAL MANAGEMENT; THERMAL RESISTANCE; THERMAL-PHYSICAL PROPERTY;

COOLING; COOLING SYSTEMS; DIODES; LIGHT EMISSION; LIQUID METALS; METALS; THERMOELECTRIC EQUIPMENT;

LIGHT EMITTING DIODES;

EID: 77955271536     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2010.04.011     Document Type: Article

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