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Volumn 42, Issue 5, 2011, Pages 632-637

Flow and heat transfer in porous micro heat sink for thermal management of high power LEDs

Author keywords

Heat dissipation; High heat flux; High power LEDs; Porous media; Porous micro heat sink

Indexed keywords

HEAT DISSIPATION; HIGH HEAT FLUX; HIGH POWER LEDS; POROUS MEDIA; POROUS MICRO HEAT SINK;

EID: 79955638452     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2011.03.009     Document Type: Article
Times cited : (50)

References (15)
  • 2
    • 34548151549 scopus 로고    scopus 로고
    • A microjet array cooling system for thermal management of high-brightness LEDs
    • DOI 10.1109/TADVP.2007.898522, Special Section on Wafer-Level Packaging
    • X.B. LUO, and S. LIU A microjet array cooling system for thermal management of high-brightness LEDs IEEE Transactions on Advanced Packaging 30 2007 475 484 (Pubitemid 47308005)
    • (2007) IEEE Transactions on Advanced Packaging , vol.30 , Issue.3 , pp. 475-484
    • Luo, X.1    Liu, S.2
  • 4
    • 62849105581 scopus 로고    scopus 로고
    • The performance of compact thermal models for LED package
    • H.T. Chen, Y. Lu, and Y.L. Gao The performance of compact thermal models for LED package Thermochimica Acta 488 2009 33 38
    • (2009) Thermochimica Acta , vol.488 , pp. 33-38
    • Chen, H.T.1    Lu, Y.2    Gao, Y.L.3
  • 5
    • 34249883833 scopus 로고    scopus 로고
    • Heat transfer behavior of high-power light-emitting diode packages
    • H.W. Ra, and K.S. Song Heat transfer behavior of high-power light-emitting diode packages Korean Journal of Chemical Engineering 24 2007 197 203
    • (2007) Korean Journal of Chemical Engineering , vol.24 , pp. 197-203
    • Ra, H.W.1    Song, K.S.2
  • 6
    • 34247871368 scopus 로고    scopus 로고
    • Microfluidic cooling of semiconductor light emission diodes
    • DOI 10.1016/j.mee.2007.01.188, PII S0167931707001347, Proceedings of the 32nd International Conference on Micro- and Nano-Engineering
    • Z.M. Wang, K. Bao, and L.P. Xu Microfluidic cooling of semiconductor light emission diodes Microelectronic Engineering 84 2007 1223 1226 (Pubitemid 46695778)
    • (2007) Microelectronic Engineering , vol.84 , Issue.5-8 , pp. 1223-1226
    • Wang, Z.M.1    Bao, K.2    Xu, L.P.3    Luo, C.X.4    Zhang, B.5    Ji, H.6    Ouyang, Q.7    Chen, Y.8
  • 7
    • 71849109588 scopus 로고    scopus 로고
    • Thermal analysis and optimization of multiple LED packaging based on a general analytical solution
    • T. Cheng, X.B. Luo, and S.Y. Huang Thermal analysis and optimization of multiple LED packaging based on a general analytical solution International Journal of Thermal Sciences 49 2010 196 201
    • (2010) International Journal of Thermal Sciences , vol.49 , pp. 196-201
    • Cheng, T.1    Luo, X.B.2    Huang, S.Y.3
  • 8
    • 1842789944 scopus 로고    scopus 로고
    • Third International Conference on Solid State Lighting
    • Y. Gu, and N. Narendran Third International Conference on Solid State Lighting 5187 2004 107 114 Proceedings of SPIE 5187 2004 107 114
    • (2004) Proceedings of SPIE , vol.5187 , pp. 107-114
    • Gu, Y.1    Narendran, N.2
  • 9
    • 55549141160 scopus 로고    scopus 로고
    • Thermal effects in packaging high power light emitting diode arrays
    • C. Adam, and G. Samuel Thermal effects in packaging high power light emitting diode arrays Applied Thermal Engineering 29 2009 364 371
    • (2009) Applied Thermal Engineering , vol.29 , pp. 364-371
    • Adam, C.1    Samuel, G.2
  • 10
    • 69349098494 scopus 로고    scopus 로고
    • Life-time estimation of high-power blue light-emitting diode chips
    • J.M. Kang, J.W. Kim, and J.H. Choi Life-time estimation of high-power blue light-emitting diode chips Microelectronics Reliability 49 2009 1231 1235
    • (2009) Microelectronics Reliability , vol.49 , pp. 1231-1235
    • Kang, J.M.1    Kim, J.W.2    Choi, J.H.3
  • 11
    • 15744405583 scopus 로고    scopus 로고
    • Chip scale thermal management of high brightness LED packages
    • DOI 10.1117/12.566061, 29, Fourth International Conference on Solid State Lighting
    • M. Arik, S. Weaver, Chip scale thermal management of high brightness LED packages, in: Proceedings of SPIE fourth International Conference on Solid State Light, Denver,CO, vol. 55, 2004, pp. 214223. (Pubitemid 40416327)
    • (2004) Proceedings of SPIE - The International Society for Optical Engineering , vol.5530 , pp. 214-223
    • Arik, M.1    Weaver, S.2
  • 13
    • 58549112371 scopus 로고    scopus 로고
    • Liquid cooling of bright LEDs for automotive applications
    • L Yan, N Cordero, and B. Frank Liquid cooling of bright LEDs for automotive applications Applied Thermal Engineering 29 2009 1239 1244
    • (2009) Applied Thermal Engineering , vol.29 , pp. 1239-1244
    • Yan, L.1    Cordero, N.2    Frank, B.3
  • 14
    • 33750629504 scopus 로고    scopus 로고
    • Garimella, Advances in mesoscale thermal management technologies for microelectronics
    • V. Suresh Garimella, Advances in mesoscale thermal management technologies for microelectronics Microelectronics Journal 37 2006 1165 1185
    • (2006) Microelectronics Journal , vol.37 , pp. 1165-1185
    • Suresh, V.1
  • 15
    • 0003534171 scopus 로고    scopus 로고
    • Xian Jiao Tong University Press Xi'an, China
    • W.Q Tao Numerical Heat Transfer 2001 Xian Jiao Tong University Press Xi'an, China in Chinese
    • (2001) Numerical Heat Transfer
    • Tao, W.Q.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.