Thermal performance of LED packages for solid state lighting with novel cooling solutions

2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011

Volumn , Issue , 2011, Pages

  Zhang, Kai ^a,b   Xiao, David G W ^c   Zhang, Xiaohua ^a   Fan, Haibo ^a   Gao, Zhaoli ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c Advanced Photoelectric Technology Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE COOLING; AIR FLOW VELOCITY; COOLING SOLUTIONS; EXPERIMENTAL DATA; FLUID-STRUCTURES; HIGH POWER LED; HIGH THERMAL; JUNCTION TEMPERATURES; PIEZOELECTRIC FANS; SOLID STATE LIGHTING; THERMAL PERFORMANCE;

AIR; COOLING; EXPERIMENTS; FANS; LIGHTING; MICROELECTRONICS; MICROSYSTEMS; MIXED CONVECTION; PIEZOELECTRICITY;

LIGHT EMITTING DIODES;

EID: 79957918338     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2011.5765839     Document Type: Conference Paper

References (10)

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