Benchmark study of metal core thermal laminates

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Volumn , Issue , 2010, Pages

  Chen, Vincent ^a   Oliver, Glenn ^a   Roberts, Kurt ^a   Amey, Dan ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENCHMARK STUDY; DIELECTRIC THICKNESS; FIGURE OF MERIT; HIGH BRIGHTNESS; LAMINATE STRUCTURES; LED PACKAGING; METAL CORE; METAL SUBSTRATE; NEW APPLICATIONS; PRINTED WIRING; TEST SAMPLES; THERMAL IMPEDANCE; THERMAL PERFORMANCE; THERMAL RESISTANCE;

CHIP SCALE PACKAGES; LAMINATES; LIGHT EMITTING DIODES; MICROSYSTEMS; MIXED CONVECTION; THERMAL CONDUCTIVITY; THREE DIMENSIONAL;

DIELECTRIC MATERIALS;

EID: 79951621842     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2010.5699663     Document Type: Conference Paper

References (3)

1. Mehmet Arik, James Petroski and Stanton Weaver, "Thermal Challenges in The Future Generation Solid State Lighting Applications: Light Emitting Diode," Inter Society Conference on Thermal Phenomena, pp. 113-120, 2002.
2. Mehmet Arik, Charles Becker, Stanton Weaver and James Petroski, "Thermal Management of LEDs: Package to System," Proc. Of SPIE, Vol. 5187, pp. 64-75, 2004.
3. Yimin Gu and Nadarajah Narendran, "A Non-Contact Method for Determining Junction Temperature of Phosophor-Converted," Proc. Of SPIE, Vol. 5187, pp. 64-75, 2004.