Thermal effects in packaging high power light emitting diode arrays

Applied Thermal Engineering

Volumn 29, Issue 2-3, 2009, Pages 364-371

  Christensen, Adam ^a   Graham, Samuel ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Array; Heat dissipation; High power light emitting diodes; Thermal management

Indexed keywords

COOLING; DC GENERATORS; DIODES; FINITE ELEMENT METHOD; HEAT RESISTANCE; LIGHT EMISSION; LIGHT SOURCES; PHYSICAL OPTICS; THREE DIMENSIONAL; WATER ANALYSIS;

3D FINITE ELEMENTS; ARRAY; CERAMIC PACKAGING; COMPACT ARRAYS; DEVICE OPERATIONS; HEAT DISSIPATION; HEAT FLOWS; HIGH POWER LIGHT EMITTING DIODES; HIGH POWERS; LED ARRAYS; LED STRUCTURES; PACKAGING RESISTANCES; PASSIVE COOLING; POWER DENSITIES; RESISTOR NETWORKS; SUB MODELS; SYSTEM LEVELS; THERMAL MANAGEMENT; THERMAL RESISTANCES;

LIGHT EMITTING DIODES;

EID: 55549141160     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2008.03.019     Document Type: Article

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