Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process(CFP)-made glass-bubble caps

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 133-136

  Yu, Hui ^a   Shang, Jintang ^a   Xu, Chao ^a   Luo, Xinhu ^a   Liu, Jingdong ^a   Zhang, Li ^b   Lai, Chiming ^b  

^a Southeast University   (China)

^b Jiangying Changdian Advanced Packaging Corporation   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL FOAMING; CHIP-ON-BOARD; GLASS BUBBLES; HIGH-POWER; INNER WALLS; LED CHIPS; LED PACKAGING; OPTICAL PERFORMANCE; PACKAGING PROCESS; SILICON SUBSTRATES; SPHERICAL GLASS; THERMAL PERFORMANCE; WAFER LEVEL; WAFER LEVEL PACKAGING; WHITE-LIGHT LEDS; WIREBONDING;

GLASS; LIGHT EMITTING DIODES; LITHOGRAPHY; PACKAGING; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICA GEL; SILICON WAFERS; SPHERES; SUBSTRATES; TECHNOLOGY; WAFER BONDING;

CHIP SCALE PACKAGES;

EID: 81355142649     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6066806     Document Type: Conference Paper

References (15)

1. Won Kyu Jeung, Sang Hyun Hyun, et al., "Silicon-Based, Multi-Chip LED Package," Electronic Components and Technology Conference, 2007.
2. Zhang R, LEE S W R, "Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation," International Conference on Electronic Packaging Technology (ICEPT), 2008.
3. Tsou C., Huang Y S, "Silicon-based Packaging Platform for Light Emitting Diode," IEEE Transactions on Advanced Packaging, 2006, 29(3):607-614.
4. Kuckmann O, "High power LED arrays Special requirements on packaging technology," Proc of SPIE, 2006, 6134(04):1-7.
5. Eklund E J, Shkel A M, "Glass Blowing on a Wafer Level," Journal of Microelectromechanical Systems, 2007, 16(2):232-239.
6. Horng R H, Chiang C C., Tsai Y L, et al., "Thermal Management Design from Chip to Package for High Power InGaN/Sapphire LED Applications," Electrochemical and Solid State Letters, 2009, 12(6):H222-H225.
7. Cao M L, Pang F Y, Zhang M C., et al., "Improved Heat-Dissipating Silicone by Nano-materials for LED Packaging," IEEE International Nanoelectronics Conference, 2008, 3:758-760.
8. James P, Gelcore, "Thermal challenges facing new generation light emitting diodes (LEDs) for lighting applications," Proceedings of SPIE, 2002, 4776:215-222.
9. Lin S C., Huang R F, Chiu C H, "Investigation of Thermally Conductive Ceramic Substrates for High-Power LED Application," International Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009:517-520.
10. Bahadur M, Norris W A, et al., "Silicone Materials for LED Packaging," Sixth International Conference on Solid State Lighting, 2006, 6337:1-7.
11. Arik M, Weaver S, "Chip scale thermal management of high brightness LED packages," Proceedings of the SPIE, 2004, 5530:214-223.
12. Jintang Shang, Boyin Chen, Wei Lin, Ching-Ping Wong, Di Zhang, Chao Xu, Junwen Liu, Qinan Huang. Lab on a Chip. 2011.
13. Jintang Shang, Xuming Chu, Deping He, Materials Science and Engineering B, 2008, 151, 157-162.
14. J. Shang, J. Liu, C. Xu, D. Zhang, B. Chen, Q. A. Huang, and J. Tang, in Proceedings of 60th Electronic Components and Technology Conference, Las Vegas, USA, IEEE, 2010, 840-845.
15. J. Shang, B. Chen, W. Lin, C.P. Wong and D. Zhang, in Proceedings of 61th Electronic Components and Technology Conference, Orlando, USA, IEEE, 2010, 1596-1603.