Research on heat dissipation of high heat flux multi-chip GaN-based white LED lamp

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

Volumn , Issue , 2011, Pages 1101-1105

  Hou, Fengze ^a   Yang, Daoguo ^a   Zhang, G Q ^a,b   Liu, Dongjing ^a  

^a GUILIN UNIVERSITY OF ELECTRONIC TECHNOLOGY   (China)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ANSYS PARAMETRIC DESIGN LANGUAGE; HIGH HEAT FLUX; LED LAMPS; MULTI-CHIP; OVERALL DESIGN; THERMAL PERFORMANCE; USER INTERFACE DESIGNS; VAPOR CHAMBER; WHITE LED;

CHIP SCALE PACKAGES; COUPLED CIRCUITS; DESIGN; FINITE ELEMENT METHOD; GALLIUM ALLOYS; GALLIUM NITRIDE; HEAT FLUX; HEAT SINKS; PACKAGING; PRINTED CIRCUIT BOARDS; THERMOANALYSIS; THERMONUCLEAR REACTIONS; USER INTERFACES; VAPORS;

LIGHT EMITTING DIODES;

EID: 81355141889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2011.6067020     Document Type: Conference Paper

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