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Volumn , Issue , 2010, Pages
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Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting
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Author keywords
[No Author keywords available]
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Indexed keywords
CIRCUIT BOARDS;
DIELECTRIC LAYER;
HIGH BRIGHTNESS LEDS;
HIGH THERMAL CONDUCTIVITY;
LEAD FRAME;
LED LIGHTING;
MECHANICAL FAILURES;
METAL SUBSTRATE;
NEW STRUCTURES;
PCB-BASED;
THERMAL DISSIPATION;
THERMAL EFFICIENCY;
THERMAL FLOWS;
THERMAL LOSS;
THERMAL MANAGEMENT;
THERMAL PERFORMANCE;
THERMAL RELIABILITY;
THERMAL RESISTANCE;
THERMAL SIMULATIONS;
THERMALLY INDUCED;
LIGHTING;
METALS;
MICROSYSTEMS;
PACKAGING;
PRINTED CIRCUIT BOARDS;
THERMAL CONDUCTIVITY;
THERMOANALYSIS;
THREE DIMENSIONAL;
LIGHT EMITTING DIODES;
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EID: 79951634559
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2010.5699479 Document Type: Conference Paper |
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Times cited : (7)
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References (5)
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