Thermal performance of high brightness LED array package on PCB

International Communications in Heat and Mass Transfer

Volumn 37, Issue 9, 2010, Pages 1266-1272

  Yung, K C ^a   Liem, H ^a   Choy, H S ^a   Lun, W K ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Computational fluid dynamics (CFD); Heat dissipation; Light emitting diode; Printed circuit board; Thermal modelling

Indexed keywords

A-THERMAL; AIR COOLING; ANALYSIS RESULTS; COMPUTATIONAL FLUID DYNAMICS METHODS; DESIGN FEATURES; DESIGN STUDIES; EXPERIMENTAL VALIDATIONS; HEAT DISSIPATION; HEAT FLOWS; HEAT TRANSFER PROCESS; HIGH BRIGHTNESS; HIGH BRIGHTNESS LEDS; IR CAMERA; LED ARRAYS; OPERATING CONDITION; PACKAGING STRUCTURE; THERMAL MANAGEMENT; THERMAL MODELLING; THERMAL PERFORMANCE; THERMAL PROFILES; THERMAL RESPONSE;

COMPUTATIONAL FLUID DYNAMICS; FLUID DYNAMICS; FLUIDS; HEAT TRANSFER; LIGHT EMISSION; LIGHT EMITTING DIODES; MIXED CONVECTION; PACKAGING; PRINTED CIRCUIT MANUFACTURE; THERMOANALYSIS; THERMOCOUPLES;

PRINTED CIRCUIT BOARDS;

EID: 77957847514     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2010.07.023     Document Type: Article

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