Liquid-phase deposition of freestanding copper foils and supported copper thin films and their structuring into conducting line patterns

Angewandte Chemie - International Edition

Volumn 51, Issue 19, 2012, Pages 4743-4746

  Kränzlin, Niklaus ^a   Ellenbroek, Stefan ^a   Durán Martín, Desirée ^a,b   Niederberger, Markus ^a  

^a ETH ZURICH   (Switzerland)

^b INSTITUTO DE CATÁLISIS Y PETROLEOQUÍMICA   (Spain)

Author keywords

conducting materials; copper; electroless deposition; metal foils; thin films

Indexed keywords

CONDUCTING MATERIALS; COPPER FOILS; COPPER THIN FILM; ELECTROLESS; ELECTRONICS APPLICATIONS; LINE PATTERN; LIQUID-PHASE DEPOSITION;

CONDUCTIVE FILMS; COPPER; ELECTROLESS PLATING; LIQUIDS; METAL FOIL; THIN FILMS; VAPOR DEPOSITION;

DEPOSITION;

EID: 84860779071     PISSN: 14337851     EISSN: 15213773     Source Type: Journal    
DOI: 10.1002/anie.201200428     Document Type: Article

References (31)

1. T. Gupta, Copper Interconnect Technology, Vol. 1, Springer, New York, 2009.
2. C. A. Harper, Electronic Materials and Processes Handbook, Vol. 3, McGraw-Hill, New York, 2004.
3. C. L. Gan, C. V. Thompson, K. L. Pey, W. K. Choi, J. Appl. Phys. 2003, 94, 1222-1228.
4. S. P. Hau-Riege, C. V. Thompson, J. Appl. Phys. 2000, 88, 2382-2385.
5. R. H. Havemann, J. A. Hutchby, Proc. IEEE 2001, 89, 586-601.
6. J. Huo, R. Solanki, J. McAndrew, J. Mater. Res. 2002, 17, 2394-2398.
7. A. Satta, D. Shamiryan, M. R. Baklanov, C. M. Whelan, Q. T. Le, G. P. Beyer, A. Vantomme, K. Maex, J. Electrochem. Soc. 2003, 150, G 300 -G 306.
8. P. J. Soininen, K. E. Elers, V. Saanila, S. Kaipio, T. Sajavaara, S. Haukka, J. Electrochem. Soc. 2005, 152, G 122 -G 125.
9. W. Xu, Y. Zhang, Z. Guo, X. Chen, J. Liu, X. Huang, S.-H. Yu, Small 2012, 8, 53-58.
10. J. Y. Cho, K. Mirpuri, D. N. Lee, J. K. An, J. A. Szpunar, J. Electron. Mater. 2005, 34, 53-61.
11. J. A. Davis, R. Venkatesan, A. Kaloyeros, M. Beylansky, S. J. Souri, K. Banerjee, K. C. Saraswat, A. Rahman, R. Reif, J. D. Meindl, Proc. IEEE 2001, 89, 305-324.
12. V. Sukharev, E. Zschech, W. D. Nix, J. Appl. Phys. 2007, 102, 053505.
13. A. Gladkikh, M. Karpovski, A. Palevski, Y. S. Kaganovskii, J. Phys. D 1998, 31, 1626-1629.
14. A. W. Hunt, S. P. Riege, J. A. Prybyla, Appl. Phys. Lett. 1997, 70, 2541-2543.
15. M. D. Allendorf, F. Maury, F. Teyssandier, Chemical Vapor Deposition, Vol. 14, The Electrochemical Society, Pennigton, 2003.
16. A. J. Bard, L. R. Faulkner, Electrochemical Methods, 2 ed., Wiley, New York, 2001.
17. J. Duffy, L. Pearson, M. Paunovic, J. Electrochem. Soc. 1983, 130, 876-880.
18. D. M. Mattox, Handbook of Physical Vapor Deposition, Andrew/Noyes, Park Ridge, 1998.
19. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, D. Josell, J. Electrochem. Soc. 2000, 147, 4524-4535.
20. J. W. Christian, The Theory of Transformation in Metals and Alloys, Pergamon, London, 1965.
21. L. B. Freund, S. Suresh, Thin Film Materials, Cambridge University Press, London, 2003.
22. K. Maex, M. R. Baklanov, D. Shamiryan, F. Iacopi, S. H. Brongersma, Z. S. Yanovitskaya, J. Appl. Phys. 2003, 93, 8793-8841.
23. C. V. Thompson, Annu. Rev. Mater. Sci. 2000, 30, 159-190.
24. S. M. Rossnagel, Thin Solid Films 1995, 263, 1-12.
25. H. Lee, S. D. Lopatin, Thin Solid Films 2005, 492, 279-284.
26. K. Ueno, T. Ritzdorf, S. Grace, J. Appl. Phys. 1999, 86, 4930-4935.
27. J. M. E. Harper, C. Cabral, P. C. Andricacos, L. Gignac, I. C. Noyan, K. P. Rodbell, C. K. Hu, J. Appl. Phys. 1999, 86, 2516-2525.
28. C. Lingk, M. E. Gross, J. Appl. Phys. 1998, 84, 5547-5553.
29. S. P. Chong, Y. C. Ee, Z. Chen, S. B. Law, Surf. Coat. Technol. 2005, 198, 287-290.
30. Y. C. Ee, Z. Chen, S. Xu, L. Chan, K. H. See, S. B. Law, J. Vac. Sci. Technol. A 2004, 22, 1852-1856.
31. M. Teen-Hang, C. Wen Ray, H. Chien-Jung, C. Chih-Jen, Jpn. J. Appl. Phys. Part 1 2004, 43.