Reduction of copper oxide film to elemental copper

Journal of the Electrochemical Society

Volumn 152, Issue 2, 2005, Pages

  Soininen, P J ^a   Elers, K E ^b   Saanila, V ^a   Kaipio, S ^a   Sajavaara, T ^c   Haukka, S ^a  

^a ASM Microchemistry Oy   (Finland)

^b ASM AMERICA   (United States)

^c UNIVERSITY OF HELSINKI   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ALCOHOLS; ALDEHYDES; CARBOXYLIC ACIDS; COPPER; COPPER OXIDES; ELASTICITY; ELECTROCHEMISTRY; ELECTRODEPOSITION; NITROGEN; OXIDATION; PHYSICAL VAPOR DEPOSITION; REACTION KINETICS; THERMODYNAMICS; VAPOR PRESSURE; VAPORIZATION;

COPPER DAMASCENE PROCESS; COPPER OXIDE FILMS; ELECTROCHEMICAL DEPOSITION (ECD); REDUCING AGENTS;

REDUCTION;

EID: 14744273517     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1839491     Document Type: Article

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