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Journal of Electronic Materials

Volumn 34, Issue 1, 2005, Pages 53-61

Texture investigation of copper interconnects with a different line width

(5) Cho, J Y a Mirpuri, K a Lee, D N b An, J K b Szpunar, J A a

a MCGILL UNIVERSITY (Canada)

b Seoul National University (South Korea)

Author keywords

Cu interconnects; Damascene; Orientation imaging microscope (OIM); Stress; Texture

Indexed keywords

ANNEALING; COPPER; ELECTROMIGRATION; GRAIN BOUNDARIES; MICROSCOPES; MICROSTRUCTURE; STRESS ANALYSIS; TEXTURES; X RAY DIFFRACTION ANALYSIS;

CU INTERCONNECTS; DAMASCENE; ORIENTATION IMAGING MICROSCOPE (OIM); TEXTURAL EVOLUTION;

OPTICAL INTERCONNECTS;

EID: 13244263039 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-005-0180-8 Document Type: Article

Times cited : (15)

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