Strain rate sensitive stretchability and fracture behavior of nanocrystalline Cu films on flexible substrate

Materials Science and Engineering: A

Volumn 536, Issue , 2012, Pages 244-248

  Cao, Z H ^a   Hu, K ^a   Meng, X K ^a  

^a NANJING UNIVERSITY   (China)

Author keywords

Crack characteristic; Cu films; Strain rate; Stretchability

Indexed keywords

CRACKS; FRACTURE; FRACTURE MECHANICS; METALLIC FILMS; NANOCRYSTALS; POLYMER FILMS; TENSILE TESTING;

CRACK CHARACTERISTIC; CU FILMS; FLEXIBLE SUBSTRATE; FRACTURE BEHAVIOR; NANOCRYSTALLINE CU; POLYMER-SUPPORTED; RATE SENSITIVE; STRAIN-RATE-DEPENDENT; STRAIN-RATES; STRETCHABILITY;

STRAIN RATE;

EID: 84856512388     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.01.006     Document Type: Article

References (33)

1. Rogers J.A., Someya T., Huang Y.G. Science 2010, 327:1603.
2. Sekitani T., Someya T. Adv. Mater. 2010, 22:2228.
3. Coulombier M., Boé A., Brugger C., Raskin J.P., Pardoen T. Scr. Mater. 2010, 62:742.
4. Shen Y.L. Prog. Mater. Sci. 2008, 53:838.
5. Yu D.Y.W., Spaepen F. J. Appl. Phys. 2004, 95:2991.
6. Sumigawa T., Murakami T., Shishido T., Kitamura T. Mater. Sci. Eng. A 2010, 527:6518.
7. Wang D., Volkert C.A., Kraft O. Mater. Sci. Eng. A 2008, 493:267.
8. Lu N.S., Suo Z.G., Vlassak J.J. Acta Mater. 2010, 58:1679.
9. Olliges S., Gruber P.A., Orso S., Auzelyte V., Ekinci Y., Solak H.H., Spolenak R. Scr. Mater. 2008, 58:175.
10. Zhang Z., Li T. Scr. Mater. 2008, 59:862.
11. Wang H.T., Nie A., Liu J.B., Wang P., Yang W., Chen B.D., Liu H.Z., Fu M. Scr. Mater. 2011, 65:377.
12. Lohmiller J., Woo N.C., Spolenak R. Mater. Sci. Eng. A 2010, 527:7731.
13. Keller R.R., Phelps J.M., Read D.T. Mater. Sci. Eng. A 1996, 214:42.
14. Zhang J.Y., Zhang X., Liu G., Zhang G.J., Sun J. Mater. Sci. Eng. A 2011, 528:2982.
15. Lu N.S., Wang X., Suo Z.G., Vlassak J.J. Appl. Phys. Lett. 2007, 91:221909.
16. Lu N.S., Wang X., Suo Z.G., Vlassak J.J. J. Mater. Res. 2009, 24:379.
17. Niu R.M., Liu G., Wang C., Zhang G., Ding X.D., Sun J. Appl. Phys. Lett. 2007, 90:161907.
18. Jonnalagadda K., Karanjgaokar N., Chasiotis I., Chee J., Peroulis D. Acta Mater. 2008, 58:4674.
19. Zhang H.Z., Jiang Z.H., Lian J.S., Jiang Q. Mater. Sci. Eng. A 2008, 479:136.
20. Hu K., Cao Z.H., Meng X.K. Mater. Sci. Eng. A 2011, 528:8546.
21. Cao Z.H., Li P.Y., Lu H.M., Huang Y.L., Meng X.K. J. Phys. D: Appl. Phys. 2009, 42:065405.
22. Guisbiers G., Overschelde O.V., Wautelet M. Acta Mater. 2007, 55:3541.
23. Kock R. J. Phys.: Condens. Matter 1994, 6:9519.
24. Avilés F., Llanes L., Oliva A.I. J. Mater. Sci. 2009, 44:2590.
25. Misraa A., Nastasi M. J. Vac. Sci. Technol. A 2000, 18:2517.
26. Li T., Huang Z.Y., Suo Z., Lacour S.P., Wagner S. Appl. Phys. Lett. 2004, 85:3435.
27. Dundurs J. J. Appl. Mech. 1969, 36:650.
28. Jacob G.C., Starbuck J.M., Fellers J.F., Simunovic S., Boeman R.G. J. Appl. Polym. Sci. 2004, 94:296.
29. Hutchinson J.W., Suo Z. Adv. Appl. Mech. 1992, 29:63.
30. Begley M.R., Bart-Smith H. Int. J. Solids Struct. 2005, 42:5259.
31. Begley M.R., Bart-Smith H., Scott O.N., Jones M.H., Reed M.L. J. Mech. Phys. Solids 2005, 53:2557.
32. Begley M.R., Scott O.N., Utz M., Bart-Smith H. Appl. Phys. Lett. 2009, 95:231914.
33. Wang H.W., Kang Y.L., Zhang Z.F., Qin Q.H. Int. J. Fract. 2003, 123:177.