In situ observation of cracks in gold nano-interconnects on flexible substrates

Scripta Materialia

Volumn 58, Issue 3, 2008, Pages 175-178

  Olliges, Sven ^a   Gruber, Patric A ^b   Orso, Steffen ^c   Auzelyte, Vaida ^d   Ekinci, Yasin ^d   Solak, Harun H ^d   Spolenak, Ralph ^a  

^a ETH ZURICH   (Switzerland)

^b UNIVERSITY OF STUTTGART   (Germany)

^c MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^d PAUL SCHERRER INSTITUTE   (Switzerland)

Author keywords

Cracking behavior; Multilayer thin films; Nanocrystalline materials; Scanning electron microscopy (SEM)

Indexed keywords

GOLD COMPOUNDS; METALLIC COMPOUNDS; MULTILAYER FILMS; SCANNING ELECTRON MICROSCOPY; THIN FILMS;

CRACKING BEHAVIOR; MULTILAYER THIN FILMS; NANO-INTERCONNECTS; POLYMERIC SUBSTRATES;

NANOSTRUCTURED MATERIALS;

EID: 36049021020     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.09.037     Document Type: Article

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