Cu/Si interface fracture due to fatigue of copper film in nanometer scale

Materials Science and Engineering: A

Volumn 527, Issue 24-25, 2010, Pages 6518-6523

  Sumigawa, Takashi ^a   Murakami, Tadashi ^a   Shishido, Tetsuya ^a   Kitamura, Takayuki ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Copper; Fatigue; Interface; Nano; Thin film

Indexed keywords

COPPER; FRACTURE; INTERFACES (MATERIALS); METALLIC FILMS; NANOTECHNOLOGY;

BENDING EXPERIMENTS; COPPER FILMS; CU FILMS; CYCLIC BENDING; FATIGUE BEHAVIOUR; INTERFACE FRACTURE; NANO; NANO SCALE; NANO-METER-SCALE; THIN-FILMS;

THIN FILMS;

EID: 77955918933     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.07.002     Document Type: Article

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