In situ TEM study on crack propagation in nanoscale Au thin films

Scripta Materialia

Volumn 65, Issue 5, 2011, Pages 377-379

  Wang, Hongtao ^a   Nie, Anmin ^a   Liu, Jiabin ^a   Wang, Peng ^a   Yang, Wei ^a   Chen, Bangdao ^b   Liu, Hongzhong ^b   Fu, Maosen ^c  

^a ZHEJIANG UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

^c NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Fracture; In situ microscopy; Migration; Thin film

Indexed keywords

ATOMIC MIGRATION; ATOMIC STEP; AU THIN FILMS; ELASTIC ENERGY DENSITY; FRACTURE MECHANISMS; IN SITU MICROSCOPY; IN-SITU STRAINING; IN-SITU TEM; MIGRATION; NANO SCALE; NANOCRYSTALLINES; NOTCH ANGLES; NOTCH-ROOT; NUCLEATION PROCESS;

CRACK PROPAGATION; CRACKS; FRACTURE; GRAIN BOUNDARIES; STRESS CONCENTRATION; THIN FILMS;

GOLD;

EID: 79959937825     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2011.05.009     Document Type: Article

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