Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Materials Science and Engineering: A

Volumn 479, Issue 1-2, 2008, Pages 136-141

  Zhang, Hanzhuo ^a   Jiang, Zhonghao ^a   Lian, Jianshe ^a   Jiang, Qing ^a  

^a Jilin University   (China)

Author keywords

Ductility; Shear localization; Strain rate; Ultrafine grained; Work hardening

Indexed keywords

CRACKS; DEFORMATION; DUCTILITY; ELECTRODEPOSITION; ELONGATION; GRAIN SIZE AND SHAPE; SHEAR DEFORMATION; STRAIN HARDENING; STRAIN RATE; TENSILE PROPERTIES; THERMAL EFFECTS;

SHEAR LOCALIZATION; TENSILE DUCTILITY; ULTRAFINE GRAIN SIZE;

COPPER;

COPPER; CRACKS; DEFORMATION; DUCTILITY; ELECTRODEPOSITION; ELONGATION; GRAIN SIZE AND SHAPE; SHEAR DEFORMATION; STRAIN HARDENING; STRAIN RATE; TENSILE PROPERTIES; THERMAL EFFECTS;

EID: 40749121191     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.06.027     Document Type: Article

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