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Materials Science and Engineering: A

Volumn 493, Issue 1-2, 2008, Pages 267-273

Effect of length scale on fatigue life and damage formation in thin Cu films

(3) Wang, D a Volkert, C A a Kraft, O a

a KARLSRUHE INSTITUTE OF TECHNOLOGY (Germany)

Author keywords

Cracking; Cu; Fatigue; Interface; Length scale; Thin film

Indexed keywords

CRACKS; EXTRUSION; FILM THICKNESS; INTERFACES (MATERIALS); METALLIC FILMS; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS; YIELD STRESS;

CU; CU FILMS; CYCLIC TENSILE; DAMAGE FORMATION; EFFECT OF LENGTH SCALE; FATIGUE BEHAVIOUR; FILM-THICKNESS; LENGTH SCALE; POLYIMIDE SUBSTRATE; THIN-FILMS;

FATIGUE DAMAGE;

EID: 49849089853 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/j.msea.2007.06.092 Document Type: Article

Times cited : (90)

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