Failure by simultaneous grain growth, strain localization, and interface debonding in metal films on polymer substrates

Journal of Materials Research

Volumn 24, Issue 2, 2009, Pages 379-385

  Lu, Nanshu ^a   Wang, Xi ^a   Suo, Zhigang ^a   Vlassak, Joost ^a  

^a HARVARD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEBONDING; DEFORMATION; FILM GROWTH; GRAIN SIZE AND SHAPE; METALLIC FILMS; POLYMER FILMS; POLYMERS; STRAIN; SUBSTRATES;

CO EVOLUTIONS; COPPER FILMS; DEFORMATION PROCESS; INTERFACE DEBONDING; LARGE GRAINS; MECHANICAL LOADINGS; METAL FILMS; NANOCRYSTALLINE METALS; POLYMER SUBSTRATES; POLYMER-SUPPORTED; STRAIN LOCALIZATIONS; THIN METAL FILMS;

GRAIN GROWTH;

EID: 61749101231     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2009.0048     Document Type: Article

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