Inverse effect of thickness on the ductility in nanocrystalline Cu films

Materials Science and Engineering: A

Volumn 528, Issue 29-30, 2011, Pages 8546-8550

  Hu, K ^a   Cao, Z H ^a   Meng, X K ^a  

^a NANJING UNIVERSITY   (China)

Author keywords

Bonding strength; Cu films; Ductility; Size effect; Tension test; Thickness

Indexed keywords

CRACKS; METALLIC FILMS; NANOCRYSTALS; TENSILE STRAIN; TENSILE TESTING;

BONDING STRENGTH; CRACK DENSITY; CU FILMS; DIFFERENT THICKNESS; EFFECTS OF THICKNESS; NANOCRYSTALLINE CU; SIZES EFFECT; TENSION TESTS; THICKNESS; UNIAXIAL TENSIONS;

DUCTILITY;

EID: 80053628842     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2011.08.033     Document Type: Article

References (25)

1. Forrest S.R. Nature 2004, 428:911-918.
2. Zhang G.P., Sun K.H., Zhang B., Gong J., Sun C., Wang Z.G. Mater. Sci. Eng. A 2008, 483-484:387-390.
3. Hwangbo Y., Song J.H. Mater. Sci. Eng. A 2010, 527:2222-2232.
4. Allameh S.M., Lou J., Kavishe F., Buchheit T., Soboyejo W.O. Mater. Sci. Eng. A 2004, 371:256-266.
5. Lu L., Sui M.L., Lu K. Science 2000, 287:1463-1466.
6. Giga A., Kimoto Y., Takigawa Y., Higashi K. Scripta Mater. 2006, 55:143-146.
7. Huang H.B., Spaepen F. Acta Mater. 2000, 48:3261-3269.
8. Xiang Y., Vlassak J.J. Scripta Mater. 2005, 53:177-182.
9. Keller R.R., Phelps J.M., Read D.T. Mater. Sci. Eng. A 1996, 214:42-52.
10. Macionczyk F., Bruckner W. J. Appl. Phys. 1999, 86:4922-4929.
11. Zhang J.Y., Zhang X., Liu G., Zhang G.J., Sun J. Scripta Mater. 2010, 63:101-104.
12. Xiang Y., Li T., Suo Z.G., Vlassaka J. Appl. Phys. Lett. 2005, 87:161910-1-161910-3.
13. Lu N.S., Wang X., Suo Z.G., Vlassak J. Appl. Phys. Lett. 2007, 91:221909-1-221909-3.
14. Niu R.M., Liu G., Wang C., Zhang G., Ding X.D., Sun J. Appl. Phys. Lett. 2007, 90:161907-1-161907-3.
15. Lu N.S., Suo Z.G., Vlassak J. Acta Mater. 2010, 58:1679-1687.
16. Cao Z.H., Li P.Y., Lu H.M., Huang Y.L., Meng X.K. J. Phys. D: Appl. Phys. 2009, 42:065405-1-065405-6.
17. Cao Z.H., Lu H.M., Meng X.K., Ngan A.H.W. J Appl. Phys. 2009, 105:083521-1-083521-4.
18. Zhu X.F., Li Y.P., Zhang G.P., Zhu S.J. Mater. Sci. Eng. A 2010, 527:3279-3283.
19. Lohmiller J., Woo N.C., Spolenak R. Mater. Sci. Eng. A 2010, 527:7731-7740.
20. Alaca B.E., Saif M.T.A., Sehitoglu H. Acta Mater. 2002, 50:1197-1209.
21. Cordill M.G., Taylor A., Schalko J., Dehm G. Metall. Mater. Trans. A 2010, 41:870-875.
22. Hsu Y.H., Lin J., Tang W.C. J. Mater. Sci.-Mater. Electron. 2008, 19:653-661.
23. Hu C.J., He Z.H., Fu W.C., Zhong Q. J. Phys. D: Appl. Phys. 2009, 42:185303-1-185303-6.
24. Zhu X.F., Zhang G.P. J. Phys. D: Appl. Phys. 2009, 42:055411-1-055411-6.
25. Li T., Suo Z. Int. J. Solids Struct. 2007, 44:1696-1705.