Microstructure-property relationship in highly ductile Au-Cu thin films for flexible electronics

Materials Science and Engineering: A

Volumn 527, Issue 29-30, 2010, Pages 7731-7740

  Lohmiller, J ^a   Woo, N C ^a   Spolenak, R ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Gold copper alloy; High ductility; Nanocrystalline materials; Shear bands; Tensile test; Thin films

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; CRACKS; DEPOSITION; DUCTILITY; FLEXIBLE ELECTRONICS; GLASS SUBSTRATES; GOLD ALLOYS; GOLD DEPOSITS; MICROSTRUCTURE; NANOCRYSTALLINE ALLOYS; NANOCRYSTALS; SILICON WAFERS; TENSILE TESTING;

CU THIN FILM; DUCTILE MATERIALS; FLEXIBLE ELECTRONICS DEVICE; FLEXIBLE SUBSTRATE; GOLD-COPPER ALLOYS; HIGH DUCTILITY; MICROSTRUCTURE-PROPERTY RELATIONSHIPS; TENSILE TEST; THIN METAL FILMS; THIN-FILMS;

THIN FILMS;

EID: 77957674074     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.08.043     Document Type: Article

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