Correlations between interfacial reactions and bonding strengths of Cu/Sn/Cu pillar bump

Microelectronic Engineering

Volumn 89, Issue 1, 2012, Pages 65-69

  Kwak, Byung Hyun ^a   Jeong, Myeong Hyeok ^a   Kim, Jae Won ^a   Lee, Byunghoon ^b   Lee, Hoo Jeong ^b   Park, Young Bae ^a  

^a Andong National University   (South Korea)

^b Sungkyunkwan University   (South Korea)

Author keywords

Cu Sn Cu pillar bump; Fracture mode; Intermetallic compound; Shear strength

Indexed keywords

ANNEALING TIME; BONDING STRENGTH; CU PILLAR; FRACTURE MODE; FRACTURE MODE TRANSITIONS; GROWTH OF INTERMETALLICS; INTERMETALLIC COMPOUND; LAP SHEAR TESTS; LINEAR RELATIONSHIPS; SQUARE ROOTS; THERMAL-ANNEALING;

BRITTLE FRACTURE; DUCTILE FRACTURE; INTERMETALLICS; SHEAR FLOW; SHEAR STRENGTH; SOLDERING ALLOYS; TIN;

ANNEALING;

EID: 81855166663     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.01.020     Document Type: Conference Paper

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