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Journal of Korean Institute of Metals and Materials

Volumn 48, Issue 11, 2010, Pages 1035-1040

Effect of multiple reflows on the mechanical Reliability of solder joint in LED package

(6) Lee, Young Chul a Kim, Kwang Seok a Ahn, Ji Hyuk a Yoon, Jeong Won a Ko, Min Kwan a Jung, Seung Boo a

a Sungkyunkwan University (South Korea)

Author keywords

Bonding; Intermetallics; Led package; Mechanical properties; Shear test

Indexed keywords

FRACTURE SURFACES; GAN-BASED LIGHT-EMITTING DIODES; INTERMETALLIC COMPOUNDS; JOINT STRENGTH; LED PACKAGE; MECHANICAL RELIABILITY; MICROSTRUCTURAL VARIATION; ORGANIC SOLDERABILITY PRESERVATIVE; PB-FREE; REFLOW PROCESS; RESEARCH EFFORTS; SHEAR FORCE; SHEAR TEST; SHEAR TESTS; SIGNIFICANT IMPACTS; SN-3.0AG-0.5CU; SOLDER JOINTS;

BRITTLE FRACTURE; FLIP CHIP DEVICES; GALLIUM NITRIDE; INTERMETALLICS; LEAD; LIGHT EMITTING DIODES; MECHANICAL PROPERTIES; MOUNTINGS; ORGANIC LIGHT EMITTING DIODES (OLED); SOLDERING; SOLDERING ALLOYS; TIN;

SURFACE MOUNT TECHNOLOGY;

EID: 78650909485 PISSN: 17388228 EISSN: None Source Type: Journal
DOI: 10.3365/KJMM.2010.48.11.1035 Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.