A study on the bonding process of Cu Bump/Sn/Cu bump bonding structure for 3D packaging applications

Journal of the Electrochemical Society

Volumn 157, Issue 4, 2010, Pages

  Lee, Byunghoon ^a   Park, Jongseo ^a   Jeon, Seong Jae ^a   Kwon, Kee Won ^a   Lee, Hoo Jeong ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

3D PACKAGING; BONDING CONDITIONS; BONDING PROCESS; BUMP BONDING; INTERMETALLIC PHASE; JOINT STRENGTH; LAP-SHEAR TESTING; MECHANICAL BEHAVIOR; MELTING TEMPERATURES; SNPB SOLDER; THREE-DIMENSIONAL (3D) PACKAGING; UNIQUE FEATURES; WETTING PROCESS;

INTERMETALLICS; MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; THREE DIMENSIONAL;

TIN;

EID: 77949770462     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3301931     Document Type: Article

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