Formation of Sn through-silicon-via and its interconnection process for chip stack packages

Journal of Korean Institute of Metals and Materials

Volumn 48, Issue 6, 2010, Pages 557-564

  Kim, Min Young ^a   Oh, Taek Soo ^a   Oh, Tae Sung ^a  

^a Hong Ik University   (South Korea)

Author keywords

Electronic materials; Joining; Microelectronic packaging; Scanning electron microscopy; Strength

Indexed keywords

EID: 77954286120     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: 10.3365/KJMM.2010.48.06.557     Document Type: Article

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