Hot-embossing performance of silicon micromold coated with self-assembled n-octadecyltrichlorosilane

Sensors and Actuators, B: Chemical

Volumn 160, Issue 1, 2011, Pages 207-214

  Saha, Biswajit ^a   Tor, Shu B ^a,b   Liu, Erjia ^b   Hardt, David E ^a,c   Chun, Jung H ^a,c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Friction coefficient; Hot embossing; Microfluidic device; OTS coatings; Surface energy

Indexed keywords

AFM; AFTER-HEAT TREATMENT; COATED SAMPLE; COATING QUALITY; COATING STRUCTURES; COMPARATIVE STUDIES; DEPOSITION TIME; EMBOSSING OPERATIONS; FAILURE MECHANISM; FRICTION COEFFICIENTS; HOT-EMBOSSING; MICRO-MOLDS; MICROFLUIDIC DEVICE; N-OCTADECYLTRICHLOROSILANE; NANOTRIBOLOGICAL TESTS; REDEPOSITION; SELF-ASSEMBLED; TOLUENE SOLVENT; WATER CONTACT ANGLE;

AGGLOMERATION; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; COATINGS; CONTACT ANGLE; FRICTION; INTERFACIAL ENERGY; MOLDS; ORGANIC SOLVENTS; SELF ASSEMBLED MONOLAYERS; SILICON; SURFACE CHEMISTRY; SURFACE PROPERTIES; THERMODYNAMIC STABILITY; TOLUENE; X RAY PHOTOELECTRON SPECTROSCOPY;

SURFACE ROUGHNESS;

EID: 81155152477     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.snb.2011.07.036     Document Type: Article

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