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Volumn 107, Issue 2, 2005, Pages 632-639
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Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels
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Author keywords
Hot embossing; Microfluidic channels; Microstructures
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
CURING;
ELECTRIC POTENTIAL;
ELECTROPHORESIS;
MICROSTRUCTURE;
PLASTICS;
PLASTICS MOLDING;
POLYMETHYL METHACRYLATES;
SILICON WAFERS;
STAMPING;
VISCOSITY;
ELECTROPHEROGRAMS;
ELECTROPHORETIC SEPARATIONS;
HOT EMBOSSING;
MICROFLUIDIC CHANNELS;
EPOXY RESINS;
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EID: 18544367818
PISSN: 09254005
EISSN: None
Source Type: Journal
DOI: 10.1016/j.snb.2004.11.035 Document Type: Article |
Times cited : (91)
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References (27)
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