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Volumn 107, Issue 2, 2005, Pages 632-639

Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels

Author keywords

Hot embossing; Microfluidic channels; Microstructures

Indexed keywords

ATOMIC FORCE MICROSCOPY; CURING; ELECTRIC POTENTIAL; ELECTROPHORESIS; MICROSTRUCTURE; PLASTICS; PLASTICS MOLDING; POLYMETHYL METHACRYLATES; SILICON WAFERS; STAMPING; VISCOSITY;

EID: 18544367818     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.snb.2004.11.035     Document Type: Article
Times cited : (91)

References (27)
  • 25
    • 18544372708 scopus 로고    scopus 로고
    • R. Oleschuk, et al. unpublished results
    • R. Oleschuk, et al., unpublished results.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.