Combinatorial analyses of plasma-polymer interactions

Surface and Coatings Technology

Volumn 205, Issue SUPPL. 2, 2011, Pages

  Setsuhara, Yuichi ^a,d   Cho, Ken ^a,d   Takenaka, Kosuke ^a,d   Shiratani, Masaharu ^b,d   Sekine, Makoto ^c,d   Hori, Masaru ^c,d  

^a OSAKA UNIVERSITY   (Japan)

^b KYUSHU UNIVERSITY   (Japan)

^c NAGOYA UNIVERSITY   (Japan)

^d JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

Combinatorial method; Density gradation plasma; Plasma nano science; Plasma polymer interaction; Plasma process analysis

Indexed keywords

ARGON-OXYGEN MIXTURES; CHEMICAL BONDING STATE; COMBINATORIAL ANALYSIS; COMBINATORIAL METHOD; DENSITY-GRADATION PLASMA; ETCHING CHARACTERISTICS; ETCHING PROPERTIES; EXPOSURE-TIME; GRADED DISTRIBUTIONS; ION DOSE; ION SATURATION CURRENT; LINEAR DEPENDENCE; PET FILMS; PHENYL GROUP; PLASMA PROCESS; PLASMA-POLYMER INTERACTION; PLASMA-PROCESS ANALYSIS; PROCESS PARAMETERS; SUBSTRATE HOLDERS; SURFACE CHEMICAL BONDING STATE;

ARGON; CHEMICAL ANALYSIS; CHEMICAL BONDS; DEGRADATION; ETCHING; IONS; OXYGEN; POLYETHYLENE TEREPHTHALATES;

PLASMAS;

EID: 80955180544     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.04.083     Document Type: Article

References (26)

1. Wada H., Lee D., Krishnamoorthy U., Zappe S., Solgaard O. Jpn. J. Appl. Phys. 2002, 41:L899.
2. Lee C.-Y., Wu G.-W., Hsieh W.-J. Sen. Actuators A 2008, 147:173.
3. Biasotto C., Diniz J.A., Daltrini A.M., Moshkalev S.A., Monteiro M.J.R. Thin Solid Films 2008, 516:7777.
4. Ideno T., Ichiki T. Thin Solid Films 2006, 506-507:235.
5. Ichiki T., Sugiyama Y., Ujiie T., Horiike Y. J. Vac. Sci. Technol. B 2003, 21:2188.
6. Jang W.W., Yoon J.-B., Kim M.-S., Lee J.-M., Kim S.-M., Yoon E.-J., Cho K.H., Lee S.-Y., Choi I.-H., Kim D.-W., Park D. Solid State Electron. 2008, 52:1578.
7. van den Boogaart M.A.F., Kim G.M., Pellens R., van den Heuvel J.-P., Brugger J. J. Vac. Sci. Technol. B 2004, 22:3174.
8. Thiénot E., Domingo F., Cambril E., Gosse C. Microelectron. Eng. 2006, 83:1155.
9. Yamada T., Uezono T., Okada K., Masu K., Oki A., Horiike Y. Jpn. J. Appl. Phys. 2005, 44:2879.
10. International Technology Roadmap for Semiconductors 2009, edition.
11. Moon C.S., Takeda K., Sekine M., Setsuhara Y., Shiratani M., Hori M. Appl. Phys. Express 2009, 2:096001.
12. Setsuhara Y., Nagao K., Shiratani M., Sekine M., Hori M. Thin Solid Films 2009, 518:1020.
13. Takenaka K., Cho K., Setsuhara Y., Shiratani M., Sekine M., Hori M. Jpn. J. Appl. Phys. 2010, 49:08JA02.
14. Moon C.S., Takeda K., Sekine M., Setsuhara Y., Shiratani M., Hori M. J. Appl. Phys. 2010, 107:113310.
15. Setsuhara Y., Cho K., Takenaka K., Shiratani M., Sekine M., Hori M. Thin Solid Films 2010, 518:6320.
16. Setsuhara Y., Shoji T., Ebe A., Baba S., Yamamoto N., Takahashi K., Ono K., Miyake S. Surf. Coat. Technol. 2003, 174-175:33.
17. Setsuhara Y. J. Plasma Fusion Res. 2005, 81:85.
18. Takenaka K., Setsuhara Y., Nishisaka K., Ebe A. Jpn. J. Appl. Phys. 2006, 45:8046.
19. Tsuda O., Ishihara M., Koga Y., Fujiwara S., Setsuhara Y., Sato N. J. Phys. Chem. B 2005, 109:4917.
20. Deguchi H., Yoneda H., Kato K., Kubota K., Hayashi T., Ogata K., Ebe A., Takenaka K., Setsuhara Y. Jpn. J. Appl. Phys. 2006, 45:8042.
21. Setsuhara Y., Takenaka K., Ebe A., Nishisaka K. Plasma Process. Polym. 2007, 4:S628.
22. Takahashi E., Nishigami Y., Tomyo A., Fujiwara M., Kaki H., Kubota K., Hayashi T., Ogata K., Ebe A., Setsuhara Y. Jpn. J. Appl. Phys. 2007, 46:1280.
23. Takenaka K., Setsuhara Y., Nishisaka K., Ebe A. Jpn. J. Appl. Phys. 2008, 47:6900.
24. Miyayama T., Sanada N., Iida S.-I., Hammondb J.S., Suzuki M. Appl. Surf. Sci. 2008, 255:951.
25. Cui N.-Y., Upadhyay D.J., Anderson C.A., Meenan B.J., Brown N.M.D. Appl. Surf. Sci. 2007, 253:3865.
26. Setsuhara Y., Cho K., Takenaka K., Shiratani M., Sekine M., Hori M. Surf. Coat. Technol. 2010, 205:S355. 10.1016/j.surfcoat.2010.08.031.