Deep dry etching of borosilicate glass using fluorine-based high-density plasmas for microelectromechanical system fabrication

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 21, Issue 5, 2003, Pages 2188-2192

  Ichiki, Takanori ^a,b   Sugiyama, Yoshinari ^a   Ujiie, Takekazu ^a   Horiike, Yasuhiro ^c  

^a TOYO UNIVERSITY   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; DRY ETCHING; FLUORINE; MICROELECTROMECHANICAL DEVICES; OPTIMIZATION; PLASMAS; SUBSTRATES; SURFACE TREATMENT;

DEEP DRY ETCHING; HIGH DENSITY PLASMAS; MICROELECTROMECHANICAL SYSTEM FABRICATION;

BOROSILICATE GLASS;

EID: 0242593745     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1612935     Document Type: Article

References (8)

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