Reactive ion etching of glass for biochip applications: Composition effects and surface damages

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 1155-1158

  Thiénot, Edouard ^a   Domingo, Florian ^a   Cambril, Edmond ^a   Gosse, Charlie ^a  

^a CNRS   (France)

Author keywords

Cone like defects; DNA electrophoresis chip; Micromasking; PECVD silica; Subtrenching

Indexed keywords

ASPECT RATIO; COMPOSITION EFFECTS; DNA; ELECTROPHORESIS; GLASS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; SILICA;

CONE-LIKE DEFECTS; DNA ELECTROPHORESIS CHIP; MICROMASKING; PECVD SILICA;

MICROPROCESSOR CHIPS;

EID: 33646063813     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.029     Document Type: Article

References (10)

1. Kaji N., Tezuka Y., Takamura Y., Ueda M., Nishimoto T., Nakanishi H., Horiike Y., and Baba Y. Anal. Chem. 76 (2004) 15
2. Steinbrüchel C. J. Electrochem. Soc. 130 (1983) 648
3. Leech P.W. Vacuum 55 (1999) 191
4. Metwalli E., and Pantano C.G. Nucl. Instr. Meth. Phys Res. B 207 (2003) 21
5. Li X., Abe T., and Esashi M. Sens. Actuat. A 87 (2001) 139
6. Ichiki T., Sugiyama Y., Ujiie T., and Horiike Y. J. Vac. Sci. Technol. B 21 (2003) 2188
7. Choi D.Y., Lee J.H., Kim D.S., and Jung S.T. J. Appl. Phys. 95 (2004) 8400
8. Fukasawa T., Hayashi T., and Horiike Y. Jpn. J. Appl. Phys. 42 (2003) 6691
9. Zeze D.A., Cox D.C., Weiss B.L., and Silva S.R.P. Appl. Phys. Lett. 84 (2004) 1362
10. In: Shul R.J., and Pearton S.J. (Eds). Handbook of Advanced Plasma Processing Techniques (2000), Springer