Combinatorial plasma etching process

Applied Physics Express

Volumn 2, Issue 9, 2009, Pages

  Moon, Chang Sung ^a   Takeda, Keigo ^a   Sekine, Makoto ^a,d   Setsuhara, Yuichi ^b,d   Shiratani, Masaharu ^c,d   Hori, Masaru ^a,d  

^a NAGOYA UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c KYUSHU UNIVERSITY   (Japan)

^d JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING CHARACTERISTICS; ETCHING PROCESS; ETCHING SYSTEMS; INTERNAL PARAMETERS; LARGE DATABASE; PLASMA ETCHING PROCESS; RADICAL DENSITIES; SCIENTIFIC DATABASE; TIME SPENT;

DIELECTRIC FILMS; PLASMA ETCHING;

PLASMAS;

EID: 70349150858     PISSN: 18820778     EISSN: 18820786     Source Type: Journal    
DOI: 10.1143/APEX.2.096001     Document Type: Article

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