Selective one-step plasma patterning process for fluidic self-assembly of silicon chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1099-1104

  Bock, Karlheinz ^a   Scherbaum, Sabine ^a   Yacoub George, Erwin ^a   Landesberger, Christof ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; FLUIDIC SELF-ASSEMBLY; PATTERNING PROCESSES; SILICON CHIPS;

SELF ASSEMBLY;

EID: 51349138474     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550112     Document Type: Conference Paper

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