Surface tension-driven chip self-assembly with load-free hydrogen fluoride-assisted direct bonding at room temperature for three-dimensional integrated circuits

Applied Physics Letters

Volumn 96, Issue 15, 2010, Pages

  Fukushima, T ^a   Iwata, E ^a   Konno, T ^a   Bea, J C ^a   Lee, K W ^a   Tanaka, T ^a   Koyanagi, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT ACCURACY; DIRECT BONDING; HYDROGEN FLUORIDE; HYDROPHILIC BONDING; LIQUID SURFACE TENSION; LOAD-FREE; MECHANICAL FORCE; ROOM TEMPERATURE; SELF-ASSEMBLED; SELF-ASSEMBLY TECHNIQUE; SI CHIPS; SI WAFER; SMALL DROPLETS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

DROP FORMATION; HYDROFLUORIC ACID; HYDROPHILICITY; INTEGRATED CIRCUITS; LIQUIDS; SELF ASSEMBLY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE PROPERTIES; SURFACE TENSION; THREE DIMENSIONAL;

WAFER BONDING;

EID: 77951604125     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3328098     Document Type: Article

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